Where Light Meets Silicon

Revolutionizing Computing at the Speed of Photons

Core Technologies

Pioneering the Future of Computing with Three Pillars of Innovation

PIC

Photonic Integrated Circuits

Revolutionary light-based computing solutions that break through traditional electronic limitations.

Advanced Packaging

Advanced Packaging

Next-generation packaging solutions enabling unprecedented integration density and performance.

Heterogeneous Integration

Heterogeneous Integration

Seamlessly combining different technologies for optimal system performance.

Quantum-Photonic Fusion

Experience the revolutionary convergence of quantum computing and photonic technology through our interactive simulation platform.

Quantum Bit Processing

Up to 100 qubits coherence time

Ultra-fast Operations

Femtosecond-scale gate operations

Cryogenic Integration

Operating at 4K temperature

Global Production Network

Real-time monitoring of our worldwide manufacturing capabilities

Global Map

Production Status

Silicon Valley Active
Tokyo Active
Shanghai Maintenance

Deep Tech Exploration

Venture into the frontiers of semiconductor innovation

Nano Observatory

Nano Observatory

Interactive atomic-level visualization platform for crystal structure exploration.

7nm to 1nm Process Visualization
Defect Detection Simulation
Quantum Tunneling Calculator
Chip Recycling

Chip Renaissance

Advanced semiconductor recycling and circular economy solutions.

Interactive Dismantling Simulator
Real-time Recovery Analytics
Certified Refurbishment Platform
Tech Strategy

Tech Strategy Simulator

Strategic decision-making platform for semiconductor industry dynamics.

Supply Chain War Game
Global Talent Flow Analysis
Patent Strategy Simulator

Global R&D Centers

Pushing the boundaries of innovation across the globe

Silicon Valley

Silicon Valley Center

Our flagship R&D facility focusing on next-generation photonic computing architecture.

450+ Research Engineers
12 Research Labs
2,800+ Patents Filed
Tokyo

Tokyo Innovation Hub

Specialized in advanced packaging and heterogeneous integration technologies.

320+ Research Engineers
8 Research Labs
1,500+ Patents Filed
Munich

Munich Research Center

Leading quantum-photonic integration and cryogenic computing research.

280+ Research Engineers
6 Research Labs
1,200+ Patents Filed